Molded Circuit Membrane Switch

Highly durable polymer circuitry produced by GDSI which is injection molded by UFE, Inc. into a three dimensional package.  It integrates both electrical and mechanical functions to provide smaller interconnection packages with higher electrical and mechanical performance features.

Design Advantage	Performance Results
3-D circuitry and substrate	Space and weight savings, total part reduction
Two-layer circuitry	Smaller package sizes
Reduced assembly processing	Integrated interconnection package leads to reduced OEM labor and material costs
Compatible with current component attachment technology	Resistors, IC's, etc. can be soldered into the package