| Design Fault |
Solution |
|
Water Ingress |
Gasket (full perimeter seal), and Carbon printed over silver traces |
|
Silver Migration |
Gasket (full perimeter seal), and Carbon printed over silver traces |
|
Cracked traces on tail |
D/SPC® to move traces to inside radius |
|
Actuation force variable between keypads |
Proper design and tight tolerance manufacturing capability |
|
Minimal packaging space |
D/SPC® or double sided copper circuitry |
|
Backlighting metal dome keypads |
Electroluminescent panel using D/SPC® for increased reliability |
|
Cracked overlay on keypad locations |
Proper design and material selection |
| Rim embossed keypad alters actuation force |
Stack up height, keypad spacer, and keypad dimension needs design improvement |
| High density keypad with multiple circuit tails |
D/SPC® reduces the need for multiple tail exits |
|
Expense |
1) matching proper materials to OEM requirements 2) reducing or eliminating assembly costs at OEM 3) reducing or eliminating field failures
|